Your Electronics Manufacturing PartnerContact Us
PCB

High Speed PCB for Communication Backplane

M6 material, 3.0mm thickness, 3.5/4mil line width, 0.25mm min hole, ENIG finish, back drilling + impedance control

Product Details

ApplicationCommunication High Speed Backplane
Layers24 Layers
Board Thickness3.0mm
MaterialM6
Line Width/Space3.5/4mil
Minimum Hole Size0.25mm
Surface FinishENIG
Special Technology12 Groups Back Drilling + 32 Groups Impedance + Depth Milling + Irregular Copper

Interested in This Product?

Contact us for detailed specifications, pricing, and lead time.

Product Enquiries Get Your Quote Today
Contact Us  →